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Length matching with a ground plane on the layer below will get you to USB 3.0 or PCIe 2.0 maybe. Maybe higher speeds need special PCB surfaces? Vias embedded in BGA lands? Not sure. Probably also would want to do simulation of the EMF for all the traces on the board, and software for that is "email us for a quote" expensive.


Oh yeah at these speeds everything is a microwave stripline




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